AMD Zen 4 Ryzen 7000: Everything you need to know

AMD Zen 4 Ryzen 7000: Everything you need to know

The six fives: DDR5, PCIe 5.0, 5nm, AM5, and 5.5 GHz+. The Zen 4 Ryzen 7000 series “Raphael” CPUs from AMD are about to be released, and recent events make this a crucial release for the firm. AMD’s previous-generation Ryzen 5000 processors achieved what was once considered to be impossible:

The chips dethroned Intel’s finest in every CPU benchmark, gaining the top spot on our list of the best CPUs for gaming as a result of AMD’s superior performance than Intel’s Rocket Lake.

Alder Lake, however, afterwards occurred. The introduction of Intel’s new hybrid x86 architecture, which combines large, powerful cores with compact, efficient cores, enabled the firm overtake competitors in terms of raw performance and even lessen its apparent weaknesses in the area of power consumption. But perhaps more crucially, Alder Lake ignited a full-fledged price war thanks to Intel’s new bare-knuckle pricing strategy, especially in the mid-range, which is known as gamer country.

But AMD isn’t going to sit still, and its Ryzen 7000 CPUs are ready to launch the contest for performance leadership at full speed. A 16-core Ryzen 7000 CPU from AMD reportedly made a stunning 5.5 GHz clock speed during a gaming demo and rendered Blender images in 31 percent less time than Intel’s top-of-the-line Core i9-12900K.

AMD says the final chips will come with up to >5.5 GHz boost clocks and are loaded with new tech, like a new integrated Radeon RDNA 2 graphics engine, and support AI instructions based on AVX-512. We’ve also learned plenty of new details about the 5nm Zen 4 Ryzen 7000 ‘Raphael’ processors and the new wave of motherboards with the AM5 socket. AMD also confirmed during its recent analyst day that not only will the standard desktop PC chips come this year, but the company will also launch the 3D V-Cache models by the end of the year.

When AMD’s Ryzen 7000 CPU debuts later this year, Intel’s Raptor Lake processors will be ready to take the lead and provide fierce opposition. This article contains all the knowledge we have gleaned from both official and unofficial sources. Here is what we currently know; we’ll update the post when we discover more.


  • Codename Raphael 
  • Up to 16 cores and 32 threads on TSMC 5nm process (N5 used for compute die)
  • (up to) >5.5 GHz boost
  • 6nm I/O die, DDR5 memory controllers, PCIe 5.0 interface
  • DDR5 only (no DDR4 support)
  • RDNA 2 integrated GPU (present on IOD)
  • Zen 4 architecture has an 8 to 10% IPC gain
  • >15% gain in single-threaded work, >35% overall performance gain (multi-threaded workloads), >25% performance-per-watt gains
  • AM5 Socket LGA 1718, backward compatible with AM4 coolers
  • 600-Series Chipset: X670E Extreme, X670, and B650 Motherboards
  • up to 170W TDP, 230W peak power
  • up to 125% more memory bandwidth per core
  • Support for AVX-512
  • 3D V-Cache Zen 4 models will come to market this year


Naturally, we don’t know how much the Ryzen 7000 product stack will cost because AMD hasn’t yet released specs for it. The 5nm technology from TSMC is said to be significantly more expensive than the 7nm process was at this point in the manufacturing process, which is worth noting. In addition, the 6nm I/O die is anticipated to be more expensive than AMD’s Ryzen 5000 series’ 12nm I/O die.

The price of the chip you buy isn’t always all that matters, though: The X670 and B650 AM5 platforms support only DDR5 memory, which has pricing implications for platforms built around AMD’s upcoming Zen 4 processors. Though the pricing differences will become smaller over time, DDR5 will remain more expensive than DDR4, regardless of supply.

That means Intel’s Raptor Lake will likely have a platform pricing advantage with readily-available DDR4 platforms, which could pay off in the mid-range and low end of the product stack. AMD has a counter with less-expensive PCIe 4.0-only X670 motherboards, but we’ll have to see how that pans out when those boards come to market.

All these factors mean you might have to pony up some extra cash compared to competing Intel Raptor Lake platforms, at least with the inaugural Zen 4 ‘Raphael’ Ryzen 7000 chips for Socket AM5. As a result, much like we saw with AMD’s high-priced debut for the Ryzen 5000 processors (AMD just finally released lower-cost Zen 3 chips a year and a half later), you can expect to pay a premium for AMD’s first Ryzen 7000 platforms when they arrive later this year.

There is an open question, though: Will AMD bring Zen 4 designs to the older AM4 motherboards? We’ve seen no concrete indications that this will happen in the near future, and it certainly wouldn’t make sense until after the full gamut of AM5 Ryzen 7000 chips are released — as a buisness, it would be a poor decision to undercut your premium products before they’re even launched. Will AM4 Zen 4 Ryzen 7000 models come later? Time will tell. 

We won’t have to wait long to see how pricing stacks up the 5nm Zen 4 Raphael Ryzen 7000 chips and the accompanying 600-series chipsets are due on the market in Fall 2022. We’re sure to learn much more as we get closer to launch, so check back for updates, which we’ll add to this article regularly.


The Ryzen 7000 series for desktop PCs, the first Zen 4 devices, will officially go on sale in Fall 2022, according to AMD (codenamed Raphael). By the end of the year, Ryzen 7000 will be available since Fall in the US begins on September 22 and ends on December 22. AMD has previously demonstrated its 16-core, 32-thread Ryzen CPU, which is likely the company’s flagship chip. If AMD sticks to precedent, it will likely release its most expensive items first. The highest core count for the Ryzen 7000 at launch is 16 cores and 32 threads, according to the manufacturer.

A photo of what seems to be a briefing with the date written on a banner has sparked reports of a launch on September 15. The fact that DigiTimes claims to have its own independent sources that claim AMD has set a mid-September delivery date makes this seem realistic. Although this is the release date, it is interesting that it falls a full week before Fall. Vendor releases are more often made near the conclusion of the specified window than at the beginning. In other words, if AMD launches early, it will be going against a long-standing tendency.

As the firm fulfills its CPU strategy and introduces the Zen 4 to the desktop and laptop markets, the Ryzen 7000 processors will just be the first step in the Zen 4 journey. For its upcoming lineup of data center CPUs, AMD will also employ the Zen 4 architecture.


Normally, we would include a complete table of specifications for each family of chips here. However, AMD hasn’t yet provided particular details on each Ryzen 7000 SKU, so we still have a lot to learn about the finished goods. However, we are quite familiar with the general parameters, such as the fact that the chips have a maximum of 16 cores and 32 threads.

AMD has also demonstrated a 16-core CPU that can run at speeds of up to 5.5 GHz while gaming, all without overclocking or the use of a special 280mm AIO cooling. The fact that the business claims the chips include “>5.5 GHz” suggests that even greater boost clock rates may be possible.

AMD shared a block diagram of the standard Ryzen 7000 chip, and we took a close-up snip of a bare Ryzen 7000 chip during the company’s Computex keynote. The chip houses two gold-colored 5nm core chiplets, each sporting eight cores. AMD says these are based on an optimized version of TSMC’s high-performance 5nm process technology (likely N5), and they are placed much closer together than we’ve seen with previous Ryzen core chiplets.

In addition, we see what appears to be a shim between the two core chiplets, likely to maintain an even surface atop the two dies. It is also possible that this close orientation is due to some type of advanced packaging interconnect between the two chips.

We can also see a clear outline around the top of each CCD, but we aren’t sure if this is from a new metallization technique. We do know that the gold color is due to Backside Metallization (BSM), which includes an Au coating to prevent oxidation while improving TIM adhesion and lowering thermal impedance. We also see quite a few empty spots for capacitors, which is interesting and could imply heftier designs down the road.

The new I/O die uses the 6nm process and houses the PCIe 5.0 and DDR5 memory controllers along with a much-needed addition for AMD — the RDNA 2 graphics engine. The new 6nm I/O die also has a low-power architecture based on features pulled in from AMD’s Ryzen 6000 chips, so it has enhanced low power management features and an expanded palette of low-power states. AMD says this chip now consumes around 20W, which is less than it did with Ryzen 5000, and will deliver the majority of the power savings we see in Ryzen 7000.

Surprisingly, the new I/O die appears to be roughly the same size as the previous-gen 12nm I/O die. However, given that the 6nm die is far denser than the 12nm die from GlobalFoundries, meaning it has far more transistors, it’s safe to assume the integrated GPU has consumed a significant portion of the transistor budget (possibly due in part to onboard iGPU cache). The large 6nm I/O die will inevitably add to the cost of the chips, as the 6nm die will be far more expensive than the mature 12nm I/O die that AMD used in the Ryzen 5000 chips.

AMD has officially confirmed that the Ryzen 7000 series chips will come with models armed with the company’s 3D V-Cache this year, enabling incredible L3 cache capacity through its innovative 3D-stacked SRAM tech that fuses an L3 chiplet on top of the compute cores. We’ve seen this technology give the Ryzen 7 5800X3D a total of 96MB of L3 cache, providing it with industry-leading gaming performance. We might have already seen signs of this memory maker TeamGroup recently mentioned the Raphael-X processors in a press release.

AMD hasn’t divulged ‘Raphael-X’ as the official name of the 3D V-Cache Ryzen 7000 chips, but it does follow the same naming convention as the Milan-X server chips that have the same tech. It’s certainly possible this is merely a mistake on TeamGroup’s part, but speculation is intense that this will be the codename for the consumer Zen 4 3D V-Cache chips.

Although AMD hasn’t divulged memory frequencies, AMD’s test notes include a benchmark with the 16-core chip running DDR5-6000 CL30, and the company has said it has already hit DDR5-6400 during validation tests. It’s unclear if those are stock frequencies or XMP/overclock values (AMD tends to use XMP profiles for its benchmarks).

AMD recently touted that it expects to have exceptional DDR5 overclockability, making the memory controllers sound impressive from afar, and the new AMD EXPO (EXtended Profiles for Overclocking) tech looks like an alternative to Intel’s XMP branding. Simply put, AMD will support pre-defined memory profiles with dialed-in memory frequencies, timings, and voltages to enable one-click memory overclocks. A newly-filed patent also points to a possible upcoming automatic memory overclocking feature that would provide more of a dynamic approach that exceeds pre-validated EXPO profile speeds.

The Ryzen 7000 chips support up to 24 lanes of the PCIe 5.0 interface directly from the socket (further details in the motherboard section). AMD is busy enabling the PCIe 5.0 SSD ecosystem with Phison, Micron, and Crucial. Crucial and Micron will have their first PCIe 5.0 SSDs in the market when AM5 motherboards arrive on the market. Additionally, the constellation of third-party SSDs will also use Phison’s E26 PCIe 5.0 SSD controllers, meaning we’ll soon see wide availability of even speedier drives

That would be helpful for Zen 4 Ryzen 7000 systems because AMD says that PCIe 5.0 SSDs increase sequential read workload performance by 60%. Phison supported that with a recent demonstration proving that their E26 SSD can read data at speeds of up to 12 GB/s (more detailed result in that link).

Microsoft’s DirectStorage will benefit greatly from the sequential performance potential of PCIe 5.0 because it mainly relies on read throughput to keep game loading times to under a second. Additionally, AMD claims that Ryzen 7000 will feature Smart Access Storage (SAS), which seems to be a slightly modified version of DirectStorage constructed using the same APIs.

Through their support of AVX-512 instructions like VNNI for neural networks and BFLOAT16 for inference, the Ryzen 7000 CPUs provide additional instructions for AI acceleration. Due to their hybrid design, Intel’s Alder and Raptor Lake processors have removed AVX-512 capabilities, which weirdly puts them at a disadvantage.


All Ryzen 7000 chips will support some form of graphics, so it doesn’t appear there will be graphics-less options, like Intel’s F-series, for now. The RDNA 2 engine resides on the IOD (I/O Die) and supports up to four display outputs, including DisplayPort 2 and HDMI 2.1 ports, and Ryzen 7000 has the same video (VCN) and display (DCN) engine as the Ryzen 6000 ‘Rembrandt” processors.

Even though all Ryzen 7000 chips will have baked-in iGPUs, the company will still release Zen 4 APUs with beefier iGPUs. The company will also bring its Smart Shift ECO tech, which allows shifting the graphical work between the iGPU and a discrete GPU to save power, to the Ryzen 7000 models for the desktop PC.

AMD has tried to temper expectations for the integrated graphics engine, pointing out that the RDNA 2 graphics are only designed to ‘light up’ displays, cautioning that we shouldn’t expect any meaningful gaming performance. AMD has said that all SKUs will have the same undisclosed number of CUs — the IOD configuration will be the same for all models. As such, it’s safe to assume we’re looking at probably 2 to 4 CUs per Ryzen 7000 chip.

If it’s any solace, the iGPU should get plenty of bandwidth from the main memory due to its close proximity to the DDR5 controllers, which are also present on the silicon. We’ll have to wait to find out the precise number of graphics engine cores, although a recent benchmark submission showed this iGPU operating between 1,000 and 2,000 MHz.

The integrated RDNA 2 engine will aid in addressing one of AMD’s major shortcomings in the OEM sector where discrete GPUs are uncommon in most computers, despite the projected low performance. If you require a simple display out, it will also be useful for debugging.


We tend to see benchmark results posted to third-party benchmark databases as processors work their way to market. Still, we’ve only seen one instance of a Zen 4 Ryzen 7000 processor listing that doesn’t come from AMD — two Ryzen 7000 submissions to the [email protected] project on the BOINC platform.

The submission doesn’t tell us much about performance, but it does expose the 100-000000666-21_N codename that likely represents the Ryzen 7 7800X that will replace the Ryzen 7 5800X. The other codename, 100-000000665-21_N, lines up with a 16-core model that is likely the Ryzen 9 7950X that will replace the Ryzen 9 5950X.

For now, most of the Zen 4 Ryzen 7000 benchmarks come from AMD, and as with all vendor-provided benchmarks, you should approach these results with caution. These chips are pre-production models, so performance is subject to change, and the test conditions could be favorable to AMD’s chips. 

During its Computex 2022 keynote, AMD CEO Lisa Su demoed a 16-core pre-production Ryzen 7000 chip running the Ghostwire: Tokyo game. As you can see from the third image, the chip topped out at an incredible 5.52 GHz, and AMD has since clarified that this boost occurred on multiple cores during the test.

The 5.5 GHz peak matches the current desktop PC frequency leader, the 5.5 GHz Intel Core i9-12900KS. Naturally, that comes with caveats: AMD only guarantees that its chips can reach the peak frequency on a single core. However, this is a significant increase over the existing Ryzen family.

AMD also demoed it’s 16-core 32-thread Ryzen 7000 chip against the 16-core 24-thread Core i9-12900K in a Blender render (we included the test notes in the above album). The Ryzen 7000 processor completed the render of a Ryzen 7000 chip in 204 seconds, which is 31% less than the 12900K’s time of 297 seconds. Notably, the Ryzen 7000 chip has 33% more threads than the 12900K, but Intel’s Raptor Lake is expected to have 32 threads, making for a close battle.

Blender supports AVX-512, which could contribute to AMD’s lead over Intel in this benchmark, which would be odd: Intel pioneered AVX-512 but disabled the instructions with the Alder Lake chips because of the complexities of scheduling work to the correct cores in the x86 hybrid architecture. Now AMD has it in its arsenal.

Additionally, although we know that the 5nm process should be more power-efficient than the 7nm process, it is possible that the higher 230W provided by the AM5 socket could help improve all-core performance, specifically during an AVX-powered workload. (The 142W PPT limit hampered performance with the 12- and 16-core Ryzen 9 5900X and 5950X during all-core workloads.) It will be interesting to see comparisons of multi-threaded performance in a broader spate of benchmarks. We do have to remember that Raptor Lake will come with four more e-cores and higher clock rates than the 12900K, so we expect a close competition between the chips in heavily-threaded work.

AMD also measured Ryzen 7000’s +15% single-threaded performance improvement by putting an unnamed pre-production 16-core Zen 4 Ryzen 7000 processor with DDR5-6000 memory up against the 16-core Ryzen 9 5950X with DDR4-3600 in a Cinebench R23 single-threaded test. Unfortunately, AMD didn’t share any specific benchmark scores, but this does give us a basic idea of how the chips will fare against Intel’s Alder Lake in this specific benchmark.

Our benchmarks show that Cinebench R23 single-threaded performance is now led by Intel’s Alder Lake CPUs. They also outperform AMD’s Ryzen 5000 CPUs overall in single-threaded performance. This has been condensed into a head-to-head comparison of the Ryzen 9 5950X with the top-tier Alder Lake Core i9-12900K below.

According to our tests, the Core i9-12900K is roughly 16% faster than the Ryzen 9 5950X in the Cinbench R23 benchmark, and AMD claims its 16-core Ryzen 7000 model is 15% faster than the 5950X. That means the Zen 4 chips will likely pull to parity with Intel’s Alder Lake in this benchmark.

Additionally, you can see that the Cinebench R23 result tracks well with our more expansive overall measurement of single-threaded performance that we use for our rankings in our CPU Benchmark hierarchy. This measurement encompasses performance in three single-threaded tests, and its similarity to the Cenbench scores suggests that Zen 4 could basically match Alder Lake in overall single-threaded performance.

Intel’s Raptor Lake will come with the same Golden Cove architecture for its performance cores (P-cores) as we saw with Alder Lake, but we expect Intel to dial up the clock rates to boost performance. As such, we can expect quite a battle for single-threaded superiority between Ryzen 7000 and Raptor Lake.

  • 2017: Zen 1 — 14nm — +52% IPC 
  • 2019: Zen 2 — 7nm — +16% IPC 
  • 2020: Zen 3 — 7nm — +19% IPC
  • 2022: Zen 4 — 5nm — +8 to 10% IPC

Although AMD’s gaming demo included a TSMC 5nm process that reached 5.52 GHz, AMD has stated that the IPC improvement over Zen 3 will only be 8 to 10%. That’s less than what we’re used to seeing with the latest AMD designs, but better power delivery can support far higher advances in threaded workloads. Additionally, AMD has been known to provide greater performance figures when final silicon approaches (such as with Zen 1’s IPC metrics).

The demo chip, AMD points out, was “a 16-core pre-production prototype not yet fused to specified power values, but was performing below our final 170W TDP requirement.” Naturally, that doesn’t tell us if the demo CPU used 50W less than the 170W specification or merely one watt less.

AMD is anxious to demonstrate that Zen 4 Ryzen 7000 offers more than just those modest IPC gains. At its Financial Analyst Day, AMD also unveiled a slide demonstrating a performance-per-watt increase of more than 25% and a performance boost of more than 35% in a multi-threaded Cinebench benchmark.

This benchmark used a 16-core 32-thread Ryzen 7000 desktop PC processor against the 16-core Zen 3 Ryzen 9 5950X. The slide is a bit misleading as it uses a non-zero axis that visually amplifies the gain, so keep that in mind. However, these are impressive generational performance gains — regardless of whether they originate from IPC, frequency, or improved power delivery and multi-core boosts. 

The Zen 4 processors will also support up to 25% more memory bandwidth per core, a marked increase that comes from both the step up to DDR5 and likely from widened pathways in the chip to deliver additional bandwidth to the cores. That will provide quite the uplift for the bandwidth-hungry AVX-512 extensions that AMD added for Zen 4.

To gain a more precise picture of performance from third-party benchmarks, we’ll need to wait a little longer. As always, until the chips are inserted into the socket on our testbed, we won’t know what you’ll see in real life.


Initially, AMD claimed that Socket AM5 would have a 170W Package Power Tracking (PPT) restriction, which meant that this would be the maximum amount of power that any one CPU could get from the socket at any one time. AMD later stated that the first figure it published was inaccurate. As opposed to the present 105W TDP cap with the Ryzen 5000 CPUs, some processors made for the AM5 socket, including the Ryzen 7000, will have a 170W TDP.

Additionally, the peak power consumption (PPT) for the AM5 socket is actually 230W. That’s a significant increase over the previous-gen Ryzen 5000’s 142W limit. Overall, the increase represents a 65W TDP and an 88W PPT increase over AMD’s current flagships.

In densely threaded tasks like the Blender benchmark the firm demonstrated during Computex, when Ryzen 7000 easily defeated Intel’s Alder Lake Core i9-12900K, the enhanced power delivery will benefit the Ryzen CPUs. The higher 170W TDP also implies that it’s completely feasible to see upgraded 12- and 16-core Ryzen 7000 processors with a 170W TDP for heavy users, while 105W 12- and 16-core variants fit in for more commonplace usage.

Increasing the TDP and PPT will help AMD deliver more performance, particularly for its higher core-count models, during heavy multi-threaded workloads. In many cases, AMD’s previous limit of 142W with the previous-gen AM4 socket held back performance, so the additional 88W of power will be particularly helpful with the newer 12- and 16-core models. In addition, AMD has specified that it will use the standard TDP and PPT calculations for chips that drop into the AM5 socket — you can simply multiply the TDP by 1.35 to calculate the maximum power consumption of the chip (PPT).


However, we do know that AMD has also increased the L2 cache per core to 1MB with Zen 4, providing the CPU cores a larger slice of near memory for workloads. AMD has disclosed very few specifics regarding the Zen 4 microarchitecture. According to AMD, finding the ideal level of L2 cache required balancing the architecture since utilizing too much increases latency and eats up die space.

With Intel’s chips, we’ve seen larger L2 caches primarily benefit data center workloads. Larger L2 caches generally reduce L3 cache accesses (theoretically by ~40% in this case), which reduces contention on the fabric, thus enabling better scalability and performance in all-core workloads —as opposed to enabling big boosts to single-threaded work.

That means there’s a chance Zen 4’s increased L2 capacity will pay off more handsomely for the EPYC Genoa server chips than it will for most desktop PC applications. But that’s not to say that AMD won’t extract benefits for other types of work, like gaming and desktop PC applications — any increase in hit rates helps improve IPC.

Expanding the above tweet reveals some of chip detective @Locuza_’s estimates for the die size for the new 6nm I/O die (IOD), predicted at 125.66mm^2, or roughly the same size as the 124.94mm^2 12nm IOD present on the Ryzen 5000 chips.

Additionally, the Zen 4 compute die (CCD) appears to measure 72.23mm^2, which is somewhat smaller than the 83.74mm^2 die on the Ryzen 5000 processor. Given that we’re looking at a much denser N5 process for Ryzen 7000 compared to the 7nm process for Ryzen 5000, the smaller die will still have more transistors. This is predicted at ~5.57B transistors for the Zen 4 CCD compared to 4.15B transistors for Zen 3 CCDs (a 34% increase for Zen 4).


With all of the capacitors dispersed around the PCB, the top of the Ryzen 7000 package appears crowded. Because of this, it is no longer necessary to use capacitors that face into the socket, such as the massive arrays of capacitors that are distributed across the LGA pads on Intel’s CPUs. As a result, only the LGA pad array is allowed to occupy the space at the bottom of the chip. (ExecuFix’s @Ryzen 7000 pad image; not affiliated with AMD.)

Ryzen’s capacitor arrangement necessitates the great-looking heatspreader the company couldn’t put the capacitors under the IHS due to heat issues but it also likely eliminates any chance of AMD adding a third die to the chip. AMD has said that Zen 4 chips will top out at 16 cores and 32 threads at launch, just like the previous-gen Ryzen 5000 series. AMD has told us that AM5 will be a similarly long-lived socket as we saw with AM4, so it’s possible we could see higher core counts in this socket in the future with newer generations of Ryzen. 

A motherboard vendor shared a video of a Ryzen 7000 processor being slotted into the new AM5 socket but then removed the video. Luckily, we grabbed some screenshots before they took the video down. This new socket marks a big departure for AMD the company is moving from its long-lived Pin Grid Array (PGA) AM4 sockets to a Land Grid Array (LGA) AM5 layout.

Despite the entirely different LGA1718 socket interface (1718 pins), the AM5 socket will still support AM4 coolers. The AM5 socket measures 40x40mm and the Ryzen 7000 chips adhere to the same length, width, Z-height, package size, and socket keep-out pattern as the previous-gen models, enabling backward support for AM4 coolers.

Interestingly, the Ryzen 7000 IHS says the chips were made and diffused in Taiwan, whereas Ryzen 5000 chips were diffused in Taiwan but made in the US. 

Additionally, a picture of the integrated heat spreader (IHS) on the underside of the Ryzen 7000, uploaded to a Facebook group by an unidentified poster, has come to light. In reality, the picture reveals a lot about the device, including the fact that AMD will keep using solder thermal interface material (TIM) in its Zen 4 Ryzen 7000 CPUs. The IHS also seems to be rather thick, which aids in heat dissipation and reduces the need for cooling.

We can also see the glue at each of the mounting points on the eight ‘arms,’ which is a departure from AMD’s seal-all-around approach with the Ryzen 5000 chips. The two compute dies ride one edge of the heat spreader. As you can see, there isn’t room for a third die inside the package unless AMD were to alter the die placements significantly. Finally, we can clearly see the cutouts that make room for the surface mount devices (SMDs) on the top of the PCB (these are mostly capacitors).

These top-facing SMDs will certainly add quite a bit of risk to delidding, but that would have limited appeal anyway, given that AMD uses solder TIM. The design does pose the risk of excess thermal paste squeezing out onto the capacitors, but that won’t be a concern with non-conductive thermal pastes.

Thanks to an MSI live broadcast, the image above shows the AM5 socket next to Intel’s socket LGA 1700, as well as the AM5 backplate and the open socket. AM5 will employ mounting gear from Foxconn and Lotes. The above album also includes thorough AM5 schematics that were provided by Igor’s Lab.

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